For precision sectioning, CBN wafering blades are useful when the material and cutting conditions call for controlled material removal with minimal deformation. The blade specification needs to match the material rather than simply choosing the finest available grit.
I usually look at bond hardness, CBN concentration, blade thickness, and feed rate together. A thin blade can reduce material loss, but it also requires good workholding and controlled loading to prevent deflection.
This CBN wafering blades guide covers different blade specifications and application factors for laboratory and materials research.
What has made the biggest difference in your sectioning work—CBN concentration, bond hardness, or feed control?