Gallium nitride is one of those semiconductor materials where blade selection directly affects edge quality and subsurface damage. For diamond-blade gallium nitride applications, I would consider the bond, diamond grit, concentration, blade thickness, and coolant together rather than treating them as separate variables.
Feed rate and spindle speed also need to be matched to the blade and substrate. Pushing the blade too aggressively can increase chipping and heat, while an overly conservative setup may cause rubbing instead of efficient cutting.
This diamond blade gallium nitride selection guide covers the main blade variables for GaN and other semiconductor materials.
What blade specification have others found most effective for GaN—particularly when edge chipping and surface damage are the main concerns?
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